New State-of-the-Art Capabilities
Electron Beam Lithography
EBL system showing inside the temperature-controlled cabin.
As shared in the previous newsletter, a new Electron Beam Lithography (EBL) system鈥EBPG 5150plus鈥攚as acquired through an NSF Major Research Instrumentation (MRI) award, thanks to the efforts of principal investigators J. Gopinath, S. Diddams, A. Jugessur, S. Sun, and W. Park.
We are pleased to announce that the EBL system has now been installed, commissioned, and successfully passed its acceptance tests. The tool is operational (see Figure 2), and our staff is currently gaining experience by running exposure jobs and developing standard operating procedures. This includes designing a training plan to onboard future users.
As mentioned previously, one of the cleanroom bays within the COSINC facility required renovations to accommodate the EBL system. Specifically, ceiling height adjustments were made, several utilities were rerouted, and multiple HEPA filters were removed to mitigate acoustic noise and vibrations that could interfere with the electron beam during pattern exposures.
The tool will be available to users by the end of September, with a select group of advanced users receiving early access. The system is integrated with Beamer (GenISys), a powerful software tool that manages electron scattering effects and optimizes pattern data. A separate training session on this software will be offered to users before the end of the calendar year.
Supporting the NQN Mission
As part of the support for the National Quantum Nanofab Facility (NQN) mission and plans, the COSINC cleanroom will accommodate several tools acquired through NQN funding. These tools will be housed within the existing cleanroom due to its established infrastructure and processing capabilities. For example, lithography work will be conducted in the COSINC cleanroom鈥檚 yellow room. This approach has helped reduce costs by streamlining and sharing resources where nanofabrication needs overlap between the current COSINC user base and the future NQN user community.
Raith Picomaster XF Laser Writer
Raith Laser Writer Picomaster XF high-throughput lithography.
Given COSINC鈥檚 longstanding professional relationship with Raith and familiarity with the unique features of their systems, a new laser writer鈥Raith Picomaster XF鈥攈as been acquired. The Picomaster XF is a standalone, high-throughput UV laser direct writer equipped with ultra-high-precision components. It utilizes multibeam exposure technology to achieve high exposure speeds. The optical module features a high-power 405 nm laser diode and a grating light valve (GLV), enabling exposure of a 200-micron stripe in a single scan.
A unique feature of the Picomaster XF is its connectivity with the recently installed EBPG 5150plus system, allowing for shared alignment marks and superior overlay alignment accuracy. This capability is critical when patterning substrates that are transferred between the two systems, significantly improving process efficiency and reducing patterning errors. Additionally, the Picomaster XF鈥檚 direct-write approach eliminates field-to-field stitching, further minimizing patterning errors.
Key performance specifications include:
- Maximum writing speed at best resolution: 280 mm虏/min
- Exposure time for a 6-inch wafer at 0.6 碌m resolution: ~60 minutes
- Capabilities: High throughput, grayscale lithography, and fine resolution
This instrument also plays a critical role in fabricating optical masks for use with the new OAI 806EIR mask aligner. Moreover, it supports direct-write lithography of complex shapes and structures on a wide range of substrates鈥攁n essential step in quantum device fabrication. Applications include exposing optical waveguides for light coupling into submicron structures and fabricating electrodes for quantum devices based on superconducting platforms.
Additional tabletop systems acquired through NQN funding include:
- Contact profilometer: KLA Tencor Model P-7
- Optical profilometer: Sensofar S neox 3D with piezo stage
- Optical microscope: Keyence VHX-X1
These tools have been installed and are already available for use.
Coming Soon: Ultra-High Resolution FIB-SEM
Another exciting addition is a state-of-the-art ultra-high-resolution Focused Ion Beam-Scanning Electron Microscope (FIB-SEM)鈥Scios 2 HiVac. While the older Nova 600i FIB-SEM remains operational and will continue to be used, the Scios 2 offers significant advancements. It features both an electron beam and a Ga鈦 focused ion beam, making it essential for quantum device fabrication and materials science research.
New ThermoFisher FIB-SEM Scios 1, to be installed in COSINC in late spring 2026.
Key capabilities of the Scios 2 include:
- Simultaneous secondary and backscattered electron imaging at low landing energies
- Ga鈦 FIB resolution from 500 eV to 30 keV
- Beam current up to 65 nA with 鈮40 A/cm虏 current density
- In-situ sample preparation and 3D characterization (e.g., FIB tomography)
- Integrated EasyLift manipulator for in-situ lift-out (INLO) of lamellae for S/TEM
- 16-bit patterning and imaging engine (PIA), 110 mm 脳 110 mm stage, optical navigation camera, plasma cleaner, and unified user interface
The Scios 2 has been purchased, and preparations are underway to retrofit an existing COSINC suite to accommodate the instrument. Delivery and operational readiness are expected by late spring 2026.
Several other tools鈥攊ncluding ICP etchers, thin-film deposition systems, metrology instruments, and packaging tools鈥攈ave also been procured. These will be delivered and installed once the NQN facility is complete. Detailed information about each tool will be available on a dedicated NQN website, currently under development and expected to launch in the coming months.
These new capabilities will not only support the NQN mission but also benefit the current COSINC user community.
New Hitachi FESEM Installed
The cold field emission FESEM SU8600, with magnification of up to 200kx.
We are excited to announce the installation of a new ultra-resolution field emission scanning electron microscope (FESEM)鈥攖he Hitachi SU8600. This advanced instrument features a cold field emission gun, magnification capabilities up to 250,000脳, two secondary electron detectors, and a backscattered electron (BSE) detector (see Figure 5). The SU8600 replaces the previous JEOL FESEM, which was damaged during a power outage in Spring 2024.
Following a lengthy insurance claim process, negotiations, and review, the new instrument was acquired, installed, and has been operational since June 2024.
In addition, through an internal CU Boulder Cores funding competition鈥RIO Core Facility Assistance Grants鈥攚e successfully secured funding to purchase an Oxford Energy Dispersive X-ray Spectroscopy (EDS) system (Model: Aztec Live Std with Ultim Infinity 40). This system will be integrated with the FESEM in Fall 2024.
EDS is a widely used chemical microanalysis technique that complements scanning electron microscopy. It detects X-rays emitted from a sample during electron beam bombardment, allowing for characterization of the elemental composition within the interaction volume. EDS can analyze a broad range of materials, including metals, ceramics, and minerals.
By adding the EDS system to the SU8600 FESEM, the instrument gains an additional dimension of analytical capability鈥攅nabling both high-resolution imaging and elemental/compositional analysis. This enhancement will significantly benefit research in materials science and quantum device fabrication.
Quantinuum (Honeywell) Donation: Oxford PlasmaPro 100 Cobra with ALE Capability
CU Boulder and COSINC are pleased to announce the generous donation of an inductively coupled plasma (ICP) etcher鈥Oxford PlasmaPro 100 Cobra, equipped with Atomic Layer Etching (ALE) capability (see Figure 6). The donation, which also includes two gas cabinets, was made by Quantinuum, a company headquartered in Broomfield, Colorado, with operations in Minnesota.
This etcher will serve both current COSINC users and the future NQN user community. It is specifically dedicated to processing III-V materials, utilizing both chlorine and fluorine chemistries. ICP reactive ion etching (RIE) is an advanced technique that offers high etch rates, excellent selectivity, and low-damage processing. It also provides superior profile control due to the ability to maintain plasma at low pressures.
The donated Oxford ICP etcher Plasma Pro100 Cobra.
The Cobra model features a high-density, uniform plasma source capable of operating at low pressures. A key advantage of this system is the independent control of substrate DC bias via a separate RF generator, which allows precise control of ion energy. This flexibility enables tailored etching results to meet specific process requirements.
This donation significantly enhances COSINC鈥檚 fabrication capabilities and supports the broader mission of the NQN by enabling advanced etching processes critical for quantum device development.